School of Materials Science and Engineering, Xi'an Jiaotong University
28 West Xianning Road, Xi'an, Shaanxi 710049, P. R. China
E-mail:yuecun.jd@gmail.com
EUDCATION
2013 - present Xi’an Jiaotong University, Xi’an, P.R.China Ph.D student in Materials Science, School of Materials Science and Engineering
2009 –2103 Northwestern Polytechnical University, Xi'AN , P.R.China
Undergraduate student in school of Material Science and Technology
RESEARCH INTEREST
In Situ Environmental/Heating/Nanomechanical TEM
Nanomechanical Characterization of Metals in Corrosive Environments
Mechanical behaviors of Si-based materials at nanoscale
AWARDS & HONORS
The “Excellent Student” honors of NWPU in the 2009-2010, 2010-2011, 2011-2012 school year.
Oct.2010 Second Prize of the NWPU Undergraduate Psychology Contest in Modeling
Sep.2012 National Scholarship
Jul. 2013 Excellent graduate in NWPU
PUBLICATIONS
Wang Y C, Zhang W, Wang L Y, et al. In situ TEM study of deformation-induced crystalline-to-amorphous transition in silicon. NPG Asia Materials, 2016, 8(7): e291.
L.Q. Zhang, Y.C. Wang, D.G. Xie, Y. Tang, C. Wu, Y. Li. In situ Transmission Electron Microscopy Study of the Electrochemical Sodiation Process for a Single CuO Nanowire Electrode. RSC Advances, 2016.
Y. C. Wang, D.G. Xie, X.H. Ning, Z.W. Shan. Thermal treatment-induced ductile-to-brittle transition of submicron-sized Si pillars fabricated by focused ion beam. Applied Physics Letters, 2015.
Y.H. He, W.Q. Jie, Y.D Xu, Y. C. Wang, Y. Zhou, H.M. Liu, G.Q. Zha. Dislocation-mediated coupling mechanism between the microstructural defects and Te inclusions in CdZnTe single crystals. Scripta Materialia, 2014.
X. Luo, J. W. Li, X. K. Huo, Y. C. Wang, Y. Q. Yang, X. R. Wang and W. Zhang, New lightweight mirror billet: connection of γ-TiAl and K9 glass with Ti6Al4V foil as interlayer, Journal of the Materials Science and Technology, 2013.
X. Luo, J. W. Li, Y. C. Wang, X. K. Huo, Y. Q. Yang, X. R. Wang and W. Zhang , A new lightweight mirror billet and its preparation method, Patent Number: 20112041732.9;
